发明名称 |
MULTILAYER PRINTED WIRING BOARD |
摘要 |
A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer 34P on a core substrate 30 is formed to have a thickness of 30 mu m and a conductor circuit 58 on an interlayer resin insulating layer 50 is formed to have a thickness of 15 mu m. By making the conductor layer 34P thick, it is possible to increase a volume of the conductor itself and decrease resistance. Further, by employing the conductor layer 34 as a power supply layer, it is possible to improve a capability of supplying power to the IC chip. <IMAGE> |
申请公布号 |
EP1553626(A1) |
申请公布日期 |
2005.07.13 |
申请号 |
EP20030712876 |
申请日期 |
2003.03.24 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
INAGAKI, YASUSHI,;SANO, KATSUYUKI, |
分类号 |
H01L23/12;H01L23/498;H05K1/02;H05K1/05;H05K1/18;H05K3/42;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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