发明名称 |
Polyimide compositions having resistance to water sorption, and methods relating thereto |
摘要 |
Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal crosslinking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250 DEG C, have a water absorption factor of less than 2%, and a have a positive solubility measurement.
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申请公布号 |
EP1553134(A2) |
申请公布日期 |
2005.07.13 |
申请号 |
EP20040027061 |
申请日期 |
2004.11.15 |
申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
DUEBER, THOMAS E.;SUMMERS, JOHN DONALD;FANG, XIN |
分类号 |
C08L79/08;C08G69/08;C08G73/10;C08K5/00;C08K5/04;C08K5/07;C08K5/101;C08K5/151;C08K5/1535;C09D179/08;C09J9/02;C09J179/08;H01C7/00;H05K1/03;(IPC1-7):C08K5/04 |
主分类号 |
C08L79/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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