发明名称
摘要 PROBLEM TO BE SOLVED: To provide a package for storing an optical semiconductor element, capable of implementing reliable optical communications using stabilized wavelengths excited by the optical semiconductor element, by allowing an electronic cooling element to cool the optical semiconductor element stably. SOLUTION: This package comprises an assembly 1 for mounting an optical semiconductor element 4 on its surface via an electronic cooling element 5, a frame 2 formed on the surface of the assembly 1 so as to surround the mounting section for the element 4 and having notches 2b on its lateral regions, connecting members 6 each fitted into the corresponding notch 2b and made of an insulator 7, which has a plurality of wiring layers 8a and 8b electrically connected to electrodes of the element 4 or 5 formed thereon, and a cover member 3 formed on the upper surface of the frame 2 for hermetically sealing the element 4. Among the layers 8a and 8b formed on the members 6, at least the layer 8a for connection with the electrodes of the element 5 is formed of a conductor layer containing Cu, and W and/or Mo, and is formed with one Cu, or W and/or Mo as the main component.
申请公布号 JP3670523(B2) 申请公布日期 2005.07.13
申请号 JP19990218063 申请日期 1999.07.30
申请人 发明人
分类号 H01L23/38;H01L23/02;H01L23/06;(IPC1-7):H01L23/02 主分类号 H01L23/38
代理机构 代理人
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