发明名称
摘要 A substrate treatment apparatus includes a substrate heating device for maintaining a substrate at a temperature higher than room temperature, a wetting device for producing a wet ozone-containing gas by wetting an ozone-containing gas with a treatment solution, and a supply device for supplying the wet ozone-containing gas from the wetting device to a work object on a surface of the substrate. The supply device includes a gas disperser including apertures aligned in rows in a width direction of the work object. The apertures in adjacent rows are not aligned with each other in a direction perpendicular to the rows. At least one of the gas disperser and the substrate is movable in a direction perpendicular to the rows. A gas conduit connects the wetting device to the supply device. A wet ozone-containing gas heating device heats the wet ozone-containing gas to a temperature at least equal to the temperature of the substrate.
申请公布号 JP3671389(B2) 申请公布日期 2005.07.13
申请号 JP20000118433 申请日期 2000.04.19
申请人 发明人
分类号 B08B7/00;C23G5/00;G03F7/42;H01L21/00;H01L21/027;H01L21/302;H01L21/3065;(IPC1-7):H01L21/306 主分类号 B08B7/00
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