发明名称 |
alignment mark, alignment system using ter same and alignment method thereof |
摘要 |
<p>An alignment mark and an exposure alignment system and method using the alignment mark for aligning wafers are described. The alignment mark is formed of a plurality of mesa or trench type unit marks that are aligned in an inline pattern within an underlying layer under a layer to which a chemical mechanical polishing process is applied to form an alignment signal during an alignment process, thereby preventing a dishing phenomenon caused by the chemical mechanical process.</p> |
申请公布号 |
KR100500469(B1) |
申请公布日期 |
2005.07.12 |
申请号 |
KR20010001733 |
申请日期 |
2001.01.12 |
申请人 |
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发明人 |
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分类号 |
G03F9/00;H01L21/027;H01L23/544;(IPC1-7):H01L21/027 |
主分类号 |
G03F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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