| 摘要 |
A high frequency module substrate device used in a high frequency module apparatus, which is adapted for switching pass-frequency characteristic of band-pass filter by switching and is adapted so that optimum band-pass filter characteristic is obtained in all pass-frequency bands, wherein a thin film capacitor element ( 18 ) is constituted between a base substrate ( 2 ) in which the uppermost layer is flattened with organic substrate being as core substrates ( 5 ), ( 6 ) to constitute a buildup formation surface ( 16 ) and a high frequency circuit unit ( 3 ) of lumped parameter design formed on the buildup formation surface in a laminated manner to carry out switching of load of parallel capacity with respect to a coupler ( 11 ) having frequency characteristic of lambda/4 which has been caused to undergo distributed parameter design at the base substrate portion side of the thin film capacitor through switch means ( 4 ).
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