| 发明名称 |
Die carrier with fluid chamber |
| 摘要 |
A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.
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| 申请公布号 |
US6917099(B2) |
申请公布日期 |
2005.07.12 |
| 申请号 |
US20030650572 |
申请日期 |
2003.08.27 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
HELLEKSON RONALD A.;CHEN CHIEN-HUA;BOUCHER WILLIAM R;SMITH JOSHUA W.;CRAIG DAVID M;WATTS GARY J. |
| 分类号 |
B81B7/02;B81B7/00;B81C99/00;H01L23/473;(IPC1-7):H01L23/02 |
主分类号 |
B81B7/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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