发明名称 |
Method for manufacturing a memory element |
摘要 |
A method for manufacturing the memory device by plasma decomposition of sulfur dioxide. A first copper electrode having a surface is provided. The surface of the first copper electrode may be made amorphous. A copper sulfide layer, Cu<SUB>x</SUB>S, where 1<=x<=2, is disposed on the copper surface by decomposing sulfur dioxide in an ambient containing excess hydrogen. The copper sulfide layer may be is cuprous sulfide or cupric sulfide. A second copper electrode is coupled to the copper sulfide layer.
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申请公布号 |
US6916696(B1) |
申请公布日期 |
2005.07.12 |
申请号 |
US20030718459 |
申请日期 |
2003.11.20 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
BUYNOSKI MATTHEW S. |
分类号 |
H01L21/8238;H01L45/00;(IPC1-7):H01L21/823 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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