发明名称 Method for manufacturing a memory element
摘要 A method for manufacturing the memory device by plasma decomposition of sulfur dioxide. A first copper electrode having a surface is provided. The surface of the first copper electrode may be made amorphous. A copper sulfide layer, Cu<SUB>x</SUB>S, where 1<=x<=2, is disposed on the copper surface by decomposing sulfur dioxide in an ambient containing excess hydrogen. The copper sulfide layer may be is cuprous sulfide or cupric sulfide. A second copper electrode is coupled to the copper sulfide layer.
申请公布号 US6916696(B1) 申请公布日期 2005.07.12
申请号 US20030718459 申请日期 2003.11.20
申请人 ADVANCED MICRO DEVICES, INC. 发明人 BUYNOSKI MATTHEW S.
分类号 H01L21/8238;H01L45/00;(IPC1-7):H01L21/823 主分类号 H01L21/8238
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