发明名称 |
Device for applying solder globules |
摘要 |
An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposite the soldering point, a means for supplying heat to the solder ball to remelt it, and a pressing apparatus for holding down the substrate to prevent the substrate from being resilient when placing and remelting the solder ball. |
申请公布号 |
US6915940(B2) |
申请公布日期 |
2005.07.12 |
申请号 |
US20030474450 |
申请日期 |
2003.12.03 |
申请人 |
PAC TECH-PACKAGING TECHNOLOGIES GMBH |
发明人 |
ZAKEL ELKE;AZDASHT GHASSEM |
分类号 |
B23K3/06;B23K101/42;H05K3/34;(IPC1-7):B23K1/00;B23K5/00;B23K20/14;B23K37/00 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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