发明名称 Three-level leadframe for no-lead packages
摘要 A semiconductor device ( 700 ) having a leadframe with a first plurality of segments ( 110 ) having a narrow end portion ( 111 ) in a first horizontal plane ( 211 ) and a wide end portion ( 112 ) in a second horizontal plane ( 212 ). The leadframe further includes a second plurality of segments ( 120 ) having a narrow center portion ( 121 ) in the first horizontal plane, at least one wide center portion ( 122 ) in the second horizontal plane, and narrow end portions ( 123 ) in a third horizontal plane ( 213 ), which is located between the first and second planes.
申请公布号 US6917098(B1) 申请公布日期 2005.07.12
申请号 US20030750102 申请日期 2003.12.29
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 YAMUNAN VINU
分类号 H01L23/48;H01L23/495;(IPC1-7):H01L23/495 主分类号 H01L23/48
代理机构 代理人
主权项
地址