发明名称 |
HEAT TRANSFER DEVICE (ALTERNATIVES), POWER SYSTEM INCORPORATING HEAT TRANSFER DEVICE (ALTERNATIVES), HEAT TRANSFER DEVICE MANUFACTURING PROCESS (ALTERNATIVES), AND ELECTRICAL COMPONENT MANUFACTURING PROCESS (ALTERNATIVES) |
摘要 |
FIELD: heat transfer devices for electronic equipment and their manufacturing process. ^ SUBSTANCE: proposed heat transfer device depending for its operation on heat dissipation has anisotropic carbon enclosed in encapsulating material to enhance strength of device accommodating anisotropic carbon. Encapsulating material may be polyamide, or epoxy resin, or polyacrylate, or ester, or other suitable polymer. ^ EFFECT: enhanced heat conductance at reduced mass and size. ^ 67 cl, 14 dwg |
申请公布号 |
RU2256307(C2) |
申请公布日期 |
2005.07.10 |
申请号 |
RU20030115417 |
申请日期 |
1999.07.08 |
申请人 |
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发明人 |
GANDI ANDZHELO;DE OLIVEJRA RUI;KARTER EHNTONI ARTUR |
分类号 |
H05K7/20;G06F1/20;H01L23/373 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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