| 摘要 |
<p>A semiconductor device which enables relaxation of thermal stress without cutting a wiring is provided. The semiconductor device has a semiconductor chip (12), a solder ball (20) for external connection, a wiring (18) for electrically connecting the semiconductor chip (12) and the solder ball (20), a stress relaxation layer (16) provided on the semiconductor chip (12), and a stress transmission section (22) for transmitting stress from the solder ball (20) to the stress relaxation layer (16) at an outer peripheral position of an electric connection section (24a) between the solder ball (20) and the wiring (18).</p> |
