发明名称 PACKAGED HOT MELT ADHESIVE AND METHOD
摘要 Multi-layer films are used to package hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. Multi-layer films wherein at least one layer has a melting point below about 100°C is used to package low application temperature hot melt adhesives.
申请公布号 KR20050072111(A) 申请公布日期 2005.07.08
申请号 KR20057006789 申请日期 2003.10.20
申请人 NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CO 发明人 HARWELL MICHAEL G.;HANER DALE L.;RYAN LEISA A.
分类号 B65B9/20;B65B63/08;B65D65/40 主分类号 B65B9/20
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