| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board capable of suppressing EMI without increasing the area of the board. SOLUTION: Separation is made in terms of high frequency, by connecting a ground wiring pattern 21b connected to a circuit block 11c of which the level of generated electromagnetic noise is relatively large to a ground wiring pattern 21a connected to respective circuit blocks 11a, 11b of which generated electromagnetic noise is relatively small via a ground wiring pattern 21c. Additionally, a place where a via hole B3 connected to the ground of a circuit block 11c is arranged is separated from a ground connection point Qb, and the respective ground wiring patterns 21a-21c are arranged so that distance L in the wiring pattern for connecting the via hole B3 to the ground connection point Qb increases. COPYRIGHT: (C)2005,JPO&NCIPI
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