发明名称 COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a cover tape for packaging electronic components, whose peeling strength has little dependence on the sealing temperature and which undergoes little deterioration with age, and allows a stable sealing capability. SOLUTION: The cover tape for packaging electronic components is a film comprised at least of three layers of a heat-sealant layer, an intermediate layer, and a substrate layer, the outermost layer being of a laminated biaxially-oriented film such as polyester, polypropylene or nylon, etc., and the intermediate layer adjacent to the heat-sealant layer showing a tensile strength in TD direction of 10 N/mm<SP>2</SP>or lower when formed into a film alone. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005178870(A) 申请公布日期 2005.07.07
申请号 JP20030424733 申请日期 2003.12.22
申请人 SUMITOMO BAKELITE CO LTD 发明人 HIRAMATSU MASAYUKI
分类号 B65D73/02;B32B27/32;B65D65/40;B65D85/86;(IPC1-7):B65D73/02 主分类号 B65D73/02
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