发明名称 GUNN DIODE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a Gunn diode the thermal conductivity characteristic, the electric conductivity characteristic, and the mechanical characteristic of a substrate of which are optimized by enhancing a degree of selection freedom of the type of materials of the substrate configuring the Gunn diode. SOLUTION: The Gunn diode is configured such that first n<SP>+</SP>-type layers 2a of a plurality of Gunn diode elements 4 are joined with the surface of the conductive substrate 1, the Gunn diode elements 4 being formed by sequentially laminating first n<SP>+</SP>-type layers 2a, n<SP>-</SP>-type layers 2b and second n<SP>+</SP>-type layers 2c of a thin film semiconductors 2, and electrode layers 3 on the surface of the substrate 1. Thus, a degree of selection freedom of the types of materials of the conductive substrate 1 is enhanced, and for example, when a material of a type with a high thermal conductivity is selected for the conductive substrate 1, the temperature rise in Gunn diode active layers (n-type layers 2b) is suppressed so that the strength of a millimeter wave output can be stabilized. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005183725(A) 申请公布日期 2005.07.07
申请号 JP20030423442 申请日期 2003.12.19
申请人 KYOCERA CORP 发明人 AONO SHIGEO;KISHIDA YUJI;DOMOTO CHIAKI
分类号 H01L47/02;(IPC1-7):H01L47/02 主分类号 H01L47/02
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