| 发明名称 |
WIRING FORMING METHOD, WIRING FORMING APPARATUS, AND WIRING BOARD |
| 摘要 |
<p>After performing one forming step of a first pattern forming step of forming a first pattern on a substrate and a second pattern forming step of forming a second pattern on the substrate, the other forming step is performed to thereby form a high-reliability wiring pattern on the substrate.</p> |
| 申请公布号 |
WO2005062685(A1) |
申请公布日期 |
2005.07.07 |
| 申请号 |
WO2004JP19486 |
申请日期 |
2004.12.20 |
| 申请人 |
SHINKAI, MICHINORI;SUZUKI, SATOSHI;CANON KABUSHIKI KAISHA |
发明人 |
SHINKAI, MICHINORI;SUZUKI, SATOSHI |
| 分类号 |
H01L21/288;H05K3/12;H05K3/46;(IPC1-7):H05K3/10;B05D1/26;B05C11/10;B05C5/00;B05D5/12 |
主分类号 |
H01L21/288 |
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代理人 |
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| 地址 |
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