| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad which can improve the uniformity of an amount of polishing in the whole surface of a material to be polished, such as a wafer, etc. in the polishing pad used in a polishing step of flattening the minute unevenness of a fine pattern formed on the surface of the material to be polished, such as a semiconductor wafer, etc., and to provide a method of manufacturing a semiconductor device using the polishing pad. <P>SOLUTION: The polishing pad includes a groove of a concentric circular shape formed on the surface of the polishing pad, in which the groove is different in a groove pitch in the radial direction of the polishing pad and the groove pitch is changed continuously in the surface of the polishing pad. The polishing pad further includes the groove of a concentric circular shape formed on the surface of the polishing pad, in which the groove is different in a groove width in the radial direction of the polishing pad and the groove width is changed continuously in the surface of the polishing pad. The method of manufacturing the semiconductor device uses these polishing pads. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
