| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which dispenses with tape material for fixing an antenna, and consequently facilitates securing of the positional accuracy of the antenna in a wire bond step. <P>SOLUTION: An antenna 4 formed in a lead frame 1 is divided into four parts, that is, first to fourth divided antennas 11 to 14, and each of the divided antennas 11 to 14 is individually fixed to the lead frame 1, and a semiconductor chip 2 is provided with a connection electrode for input/output connected to an internal circuit and a connection electrode for relay electrically separated from the internal circuit, and the divided antennas 11 to 14 are each connected through a metallic wire 23 to the connection electrode for relay, and an antenna conduction path is continuously formed from the first divided antenna 11 to the fourth divided antenna 14, and the both end parts of the antenna 4 are connected through the metallic wire 23 to the connection electrode for input/output. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
