SEMICONDUCTOR CARRIER, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To increase the second mounting reliability of a semiconductor device by preventing a problem with falling off of an external connection terminal from a semiconductor carrier, destruction of an external connection terminal, or the like which tends to occur when the semiconductor carrier having a linear expansion coefficient largely different from that of a mounting substrate is used to form a semiconductor device.

SOLUTION: A plurality of electrodes 5 and a wiring pattern connected to the electrodes 5 are formed on the upper surface of an insulating substrate 4. An external connection terminal 7 electrically connected with the wiring pattern is formed on the lower surface of the insulating substrate 4. A semiconductor element 2 having a plurality of projected electrodes 1 joined to the plurality of electrodes 5 is mounted. In a semiconductor carrier 3 connected to a mounting substrate 10 via the external connection terminal 7, a first insulating coating material 11 for increasing an adhesion between the insulating substrate 4 and the external connection terminal 7 is arranged on the lower surface of the insulating substrate 4 to cover at least the outer periphery of the external connection terminal 7. A second insulating coating material 12 for suppressing warpage or deformation in the insulating substrate 4 caused by the first insulating coating material 11 is arranged on the upper surface of the insulating substrate 4.

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