| 摘要 |
PROBLEM TO BE SOLVED: To supply an electronic component simultaneously realizing the antipodal specifications of an improvement in a performance and the improvement in a durability in which electronic equipment is miniaturized, a high-density mounting is enabled and an adverse effect on the equipment is eliminated, by a simple constitution. SOLUTION: The electronic component has a plurality of elements, pairs of terminal sections formed to each of a plurality of the elements and packaging materials covering the elements and parts of the terminals. In the electronic component, the generation of a leakage current or the like among terminals led out to the outside of the armoring materials is prevented by a constitution in which nonconductive shielding sections are formed among the adjacent terminal sections led out to the outside of the packaging materials. COPYRIGHT: (C)2005,JPO&NCIPI
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