发明名称 Manufacturing method of solid-state image pickup device, and solid-state image pickup device
摘要 A p-type region of a light receiving section is formed by implanting boron ions from the direction normal to a semiconductor substrate. The ion implantation conditions of boron are a few hundred to 4 MeV for the ion implantation energy, 1x10<SUP>10 </SUP>to 1x10<SUP>12 </SUP>ions/cm<SUP>2 </SUP>for the implanted dose, and 0 degree±0.2 degrees for an ion implantation angle (theta) with respect to the direction normal to the surface of the semiconductor substrate.
申请公布号 US2005145963(A1) 申请公布日期 2005.07.07
申请号 US20040021846 申请日期 2004.12.23
申请人 SHARP KABUSHIKI KAISHA 发明人 SAITOH SATOSHI
分类号 H01L27/148;H01L21/00;H01L21/265;H01L27/14;H01L27/146;H01L31/00;H01L31/10;H04N5/335;H04N5/369;(IPC1-7):H01L21/00 主分类号 H01L27/148
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