| 摘要 |
PROBLEM TO BE SOLVED: To enhance adhesion between a thin film and a substrate in a transparent conductive sheet having the thin film such as ITO impossible to achieve by conventional technology. SOLUTION: The transparent conductive sheet 1 is constituted by laminating a transparent synthetic resin sheet 2 and a transparent conductive thin film 3, and when the density in the vicinity of an interface of the transparent synthetic resin sheet 2 of the transparent conductive thin film 3 is represented by A, and the density in a part other than the vicinity of the interface is represented by B, A/B is made 0.800-0.999, or 1.001-1.200. An inorganic compound thin film 4 may be interposed between the sheet 1 and the thin film 3. COPYRIGHT: (C)2005,JPO&NCIPI
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