发明名称 METHOD AND DEVICE FOR FORMING WIRING, WIRING BOARD, AND INK SET
摘要 PROBLEM TO BE SOLVED: To suppress bleeding in the contact region between conductive and insulating patterns even if simultaneously forming the conductive and insulating patterns on a substrate, and to form a fine circuit pattern. SOLUTION: First liquid contains a first constituent and forms the conductive pattern. Second liquid contains a second constituent in which interface coagulation is generated in the contact region by coming into contact with the first constituent and forms the insulating pattern. The first liquid and the second one are supplied to the substrate so that they contact each other, thus forming wiring comprising the insulating pattern and conductive pattern on the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005183803(A) 申请公布日期 2005.07.07
申请号 JP20030424988 申请日期 2003.12.22
申请人 CANON INC 发明人 MORI TAKASHI;IWATA KAZUO;TSURUOKA YUJI;NISHIWAKI OSAMU;TAKAYAMA HIDETO;MOTAI HIDEKAZU
分类号 H01L21/288;H05K3/10;H05K3/12;H05K3/46;(IPC1-7):H01L21/288 主分类号 H01L21/288
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