发明名称 |
METHOD AND DEVICE FOR FORMING WIRING, WIRING BOARD, AND INK SET |
摘要 |
PROBLEM TO BE SOLVED: To suppress bleeding in the contact region between conductive and insulating patterns even if simultaneously forming the conductive and insulating patterns on a substrate, and to form a fine circuit pattern. SOLUTION: First liquid contains a first constituent and forms the conductive pattern. Second liquid contains a second constituent in which interface coagulation is generated in the contact region by coming into contact with the first constituent and forms the insulating pattern. The first liquid and the second one are supplied to the substrate so that they contact each other, thus forming wiring comprising the insulating pattern and conductive pattern on the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005183803(A) |
申请公布日期 |
2005.07.07 |
申请号 |
JP20030424988 |
申请日期 |
2003.12.22 |
申请人 |
CANON INC |
发明人 |
MORI TAKASHI;IWATA KAZUO;TSURUOKA YUJI;NISHIWAKI OSAMU;TAKAYAMA HIDETO;MOTAI HIDEKAZU |
分类号 |
H01L21/288;H05K3/10;H05K3/12;H05K3/46;(IPC1-7):H01L21/288 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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