SEMICONDUCTOR MOUNTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor mounting apparatus capable of miniaturization. SOLUTION: The apparatus is a multilayer substrate 1 where a layer 2 to a layer 4 are stacked and a cavity is formed. The cavity forms rectangular drilled parts 2a, 3a having two pairs of long sides in the layers 2, 3. A pair of exposed level difference surfaces is formed from a predetermined region on the surface of the substrate 1 to between the layers. A semiconductor element 5 having a perpendicular angle with respect to a cavity bottom surface is mounted. The long side of the drilled part 3a of the deeper layer 3 than the level difference surfaces and the long side of the drilled part 2a of the shallower layer 2 than the level difference surfaces intersect orthogonally. Four corners of the drilled part 3a of the deeper layer 3 than the level difference surfaces are stacked on a part other than the drilled region of the shallower layer 2 than the level difference surfaces. Consequently, a recognition mark for a die bonding apparatus is made to be unnecessary to miniature the semiconductor mounting apparatus. COPYRIGHT: (C)2005,JPO&NCIPI