| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems in a packaging method for a drive LSI to a large-sized flat display panel that a picture frame cannot be maintained small in spite of employing COG method to package the drive LSId directly to a panel substrate; the reduction of flexible substrates, cost reduction and simplification are not achieved; warpage arises and unevenness is produced in a display element in joining at a high temperature about 200°C and therefore direct packaging is impossible. SOLUTION: A packaging apparatus is disclosed which performs input wiring of the driver LSI and a control chip for transmitting a display signal to the driver LSI by serial transmission, packages the driver LSI directly to the wiring on a panel substrate while maintaining the frame small and realizes distortion-free packaging of the driver LSI to the flat display panel connected with the external wiring in the flexible substrate at one point at a low temperature. COPYRIGHT: (C)2005,JPO&NCIPI
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