| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition which is excellent in heat resistance, adhesive property, processability, etc. compared to conventional epoxy resin adhesives for printed wiring boards. SOLUTION: The adhesive composition contains a methoxy group-containing silane-modified epoxy resin (A) which is obtained through dealcoholization of a bisphenol epoxy resin (a-1) and a methoxysilane partial condensate (a-2), an acrylic polymer (B) which comprises a carboxyl group and/or a hydroxyl group and has a glass transition point of≤20°C and an epoxy resin hardener (C). COPYRIGHT: (C)2005,JPO&NCIPI
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