Apparatus and method for processing substrate

摘要

An apparatus and a method for processing substrate are generally used for apparatuses for wet-type process of substrate, such as an electrolytic processing apparatus for use in forming interconnects by embedding a metal such as copper (Cu) or the like in fine interconnect patterns (recesses) that are formed in a substrate such as a semiconductor wafer and for use in forming bumps for electrical connections. The substrate processing apparatus includes: a substrate holder for holding a substrate; a first electrode for contacting the substrate to supply electricity to a processing surface of the substrate; a second electrode disposed so as to face the processing surface of the substrate held by the substrate holder; and a processing liquid supply section for supplying a processing liquid into the space between the processing surface of the substrate held by the substrate holder and the second electrode, wherein the substrate holder is designed to rotate the substrate during processing in such a manner that acceleration and slowdown and/or normal rotation and reverse rotation are repeated.