发明名称 COMPENSATION OF SPACING BETWEEN MAGNETRON AND SPUTTER TARGET
摘要 <p>A lift mechanism (124) for and a corresponding use of a magnetron (70) in a plasma sputter reactor (30). The magnetron rotating about the target axis (76) is controllably lifted away from the back of the target (34) to compensate for sputter erosion. The apparatus includes a drive source (84), housing (94), tank (118), water bath (116), fixed gear (92), drive plate (96), carrier (81), magnetic yoke (80), isolator (38). Adapter (36), shield (52), vacuum pump system (44), RF power supply (58), capacitive coupling circuit (60), gas source (46), mass flow controller (48), reactor wall (32), magnet ring (114), DC power supply (54), pedestal electrode (40), wafer (42), clamp ring (50), inner magnetic pole (74), outer pole (78), follower shaft (102), follower gear (100), idler gear (98), and planetary scanning mechanism (90).</p>
申请公布号 WO2005061753(A1) 申请公布日期 2005.07.07
申请号 WO2004US40907 申请日期 2004.12.07
申请人 APPLIED MATERIALS, INC. 发明人 DING, PEIJUN;LUBBEN, DANIEL, C.;HONG, ILYOUNG, RICHARD;MILLER, MICHAEL, ANDREW;YANG, HSIEN-LUNG;RENGARAJAN, SURAJ;SUNDARRAJAN, ARVIND;YOUNG, DONNY;ROSENSTEIN, MICHAEL;LOWRANCE, ROBERT, B.;SANKARANARAYAN, SREEKRISHNAN;YOSHIDOME, GOICHI
分类号 C23C14/32;C23C14/34;C23C14/35;C23C14/54;H01J37/34;(IPC1-7):C23C14/34 主分类号 C23C14/32
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