<p>Disclosed is a multilayer body which is suitably used as an insulating layer for electronic mounting or an adhesive film for securing semiconductor wafers in semiconductor devices. Also disclosed are various laminates using such a multilayer body and a method for producing such a multilayer body. Specifically disclosed is a multilayer body (I) comprising a base layer (A) and an adhesive layer (B) wherein the layer (B) is formed on either or both sides of the layer (A). The layer (A) is a film composed of (A-1) a specific fully aromatic polyimide (PI<A-1>) or (A-2) a specific fully aromatic polyamide (PA<A-2>). The layer (B) is composed of (B-1) a specific fully aromatic polyimide (PI<B-1>), (B-2) a specific fully aromatic polyamide (PA<B-2>) or (B-3) a resin composition (RC<B-3>) composed of a specific fully aromatic polyimide (PI<B-3>) and a specific fully aromatic polyamide (PA<B-3>).</p>
