发明名称 JOINING METHOD, JOINING STRUCTURE, JOINING DEVICE, MANUFACTURING METHOD FOR DROPLET EJECTION HEAD, DROPLET EJECTION HEAD, AND DROPLET EJECTOR
摘要 PROBLEM TO BE SOLVED: To provide a joining method, a joining structure and a joining device, which can enhance reliability of joining while reducing joining costs; and to provide a highly reliable droplet ejection head, a manufacturing method for the droplet ejection head, and a droplet ejector. SOLUTION: The joining device 400 is equipped with a laser generator 401, a galvanometer mirror 402 which reflects laser light from the laser generator 401 toward a condensing lens 403, and the condensing lens 403 which is arranged in the state of facing the galvanometer mirror 402. The joining structure 404 is irradiated with the laser light presenting an energy distribution wherein the energy of the laser light to be applied to a laminated structure 405 arranged near an end of the joining structure 404 is greater than that of the laser light to be applied to the laminated structure 405 arranged in a central part of the joining structure 404. Thus, a metal 120 for joining, which is interposed between a lead electrode 90 and external wiring 111, is melted, so that an electrode part 310 and an external wiring cable 110 can be joined together. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005178220(A) 申请公布日期 2005.07.07
申请号 JP20030423744 申请日期 2003.12.19
申请人 SEIKO EPSON CORP 发明人 SAWAKI DAISUKE;UMETSU KAZUNARI
分类号 B41J2/16;(IPC1-7):B41J2/16 主分类号 B41J2/16
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