Reflection or transmission photomask for projection onto semiconductor substrate, e.g. wafer, in integrated circuit production, has substrate with opaque or semitransparent layer(s) covered by passivating layer with unpolar surface

摘要

Photomask (1), for projecting a pattern on the mask onto a semiconductor substrate, comprises a substrate (3), first opaque or semitransparent layer(s) (5, 6), in which the pattern is formed as numerous openings (9), and a passivating layer with an unpolar surface on the first layer. An independent claim is also included for production of the mask.