| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low-cost method and apparatus of forming through-holes in a thin-film substrate which can suppress the occurrence of sagging and cracking of the substrate and can smoothly remove slag after punching even if a clearance between a punch and a corresponding die opening is enlarged, and to provide a method of manufacturing a thin-film solar battery using the method. <P>SOLUTION: The apparatus of forming through-holes in the thin-film substrate comprises a punch plate 11 having a plurality of punches 2, die 3 having a plurality of openings 3a facing the punches 2, press plate 7 which has a plurality of holes for passing the punch through which is installed on the punch plate 11 via a spring means 13 for pressing the substrate, lower mold 4 for fixing the die, upper mold 5 which is installed opposite to the lower mold 4 and moves the punch plate 11 up and down, and press unit 14 for pressurizing the upper mold 5. The air 10 of a prescribed pressure is supplied from the anti-substrate side of the plurality of openings of the die 3. With the prescribed pressure of the air working on the die opening-side surface of the substrate 1a, punching is carried out by the punches 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
