| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of packaging even in an element in which the numbers of bumps arranged in the vicinities of respective sides opposed to each other are sharply different. SOLUTION: A plurality of lands 122 are arrayed correspondingly to bumps 132 arrayed along one side of a driver IC 80 to be packaged so as to be respectively used for outputting electric signals. A plurality of lands 121 smaller than the number of lands 122 and having the same plane area as that of the lands 122 are arrayed correspondingly to a plurality of bumps 131 arrayed along the side opposed to one side of the driver IC 80 so as to be respectively used for inputting electric signals. Lands 123 are arranged in a column formed by the plurality of lands 122 correspondingly to bumps 133 arrayed in a column formed by the plurality of bumps 132 and having a plane area larger than the lands 122 so as not to be used for the input/output of electric signals. COPYRIGHT: (C)2005,JPO&NCIPI
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