发明名称 Copper molybdenum electroless deposition process and materials
摘要 Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a soluble source of molybdenum ions, and a reducing agent comprising boron, wherein the composition is adapted to electrolessly produce a copper molybdenum deposit.
申请公布号 US2005145133(A1) 申请公布日期 2005.07.07
申请号 US20040750716 申请日期 2004.01.02
申请人 SHACHAM-DIAMAND YOSSI;SVERDLOV YELENA 发明人 SHACHAM-DIAMAND YOSSI;SVERDLOV YELENA
分类号 B05D1/18;C23C18/16;C23C18/18;C23C18/40;C23C18/48;(IPC1-7):B05D1/18 主分类号 B05D1/18
代理机构 代理人
主权项
地址