发明名称 |
Copper molybdenum electroless deposition process and materials |
摘要 |
Materials and methods are described for electroless deposition of copper molybdenum. An aqueous bath composition for the electroless deposition of copper molybdenum includes; a soluble source of copper ions, a soluble source of molybdenum ions, and a reducing agent comprising boron, wherein the composition is adapted to electrolessly produce a copper molybdenum deposit.
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申请公布号 |
US2005145133(A1) |
申请公布日期 |
2005.07.07 |
申请号 |
US20040750716 |
申请日期 |
2004.01.02 |
申请人 |
SHACHAM-DIAMAND YOSSI;SVERDLOV YELENA |
发明人 |
SHACHAM-DIAMAND YOSSI;SVERDLOV YELENA |
分类号 |
B05D1/18;C23C18/16;C23C18/18;C23C18/40;C23C18/48;(IPC1-7):B05D1/18 |
主分类号 |
B05D1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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