发明名称 ELECTRONIC PARTS, MODULE, MODULE ASSEMBLING METHOD, IDENTIFICATION METHOD, AND ENVIRONMENT SETTING METHOD
摘要 <p>It is possible to provide electronic parts for assembling a module by superimposing a plurality of layers with identical configuration. Each terminal of each terminal groups (31 to 36) is formed to be rotationally symmetric with a predetermined number of settings or symmetric with respect to the plane containing the rotational symmetry and the symmetric axis line. Each of the terminals (A0 to A7, RFCG) of common connection terminal groups (32, 36)has a connection portion formed on the surface section of both sides of the superimposing direction. Among the terminals of individual connection terminal groups (31, 33), a particular terminal CS;KEY has a connection portion formed at least on one of the sides of the superimposing direction of the surface section while the remaining associated terminal NC;DMY has a connection portion formed on the surface section of both sides of the superimposing direction. Such an electronic part (20) can be shifted by the angle obtained by dividing 360 degrees by the predetermined number of settings or added and reversed so as to be superimposed, thereby preferably assembling a module.</p>
申请公布号 WO2004107440(B1) 申请公布日期 2005.07.07
申请号 WO2004JP07377 申请日期 2004.05.28
申请人 SHARP KABUSHIKI KAISHA;TOSHIBA CORPORATION;RENESAS TECHNOLOGY CORPORATION;SATOH, TOMOTOSHI;NEMOTO, YOSHIHIKO;TAKAHASHI, KENJI;AKIYAMA, YUKIHARU 发明人 SATOH, TOMOTOSHI;NEMOTO, YOSHIHIKO;TAKAHASHI, KENJI;AKIYAMA, YUKIHARU
分类号 H01L25/18;H01L23/48;H01L25/065;H01L25/10;H01L25/11;H01L29/06;(IPC1-7):H01L25/065;H01L25/07 主分类号 H01L25/18
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