| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To eliminate the effect of high frequency noise on a wireless circuit device. <P>SOLUTION: A synthesizer section 6 is mounted on one side of a printed board 1 including a conductive layer 11f to be grounded, and a double-sided board for connection having through holes connected with the conductive layer 11f is arranged on one side of the printed board 1 to surround four side faces of the synthesizer section 6. The through hole connected with the conductive layer 11f is connected with the grounded conductive layer 9b of a mother board 8 at a terminal 5a. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
