发明名称 MOLD CLAMP MECHANISM OF ELECTROMOTIVE INJECTION MOLDING MACHINE
摘要 PROBLEM TO BE SOLVED: To provide a mold clamp mechanism of an electromotive injection molding machine which satisfies an expansion rate of force of 4-point type toggle link and an opening/closing speed of 5-point type toggle link. SOLUTION: The mold clamp mechanism is equipped with a short link 8 and a long link 9 which are connected to each other through a joint A and are also connected to a rear plate 6 and a moving plate 7 by joints B and C, and a joint D at a cross head 11 driven by servomotor mounted in the rear plate 6 is moved to expand the short link 8 and the long link 9 which elongate a tie bar 5 fixed to the rear plate 6 and a fixing plate 4, whereby clamp force is loaded on a molding plate. In the mechanism, the 1st link 12a and the 2nd link 12b are installed between the joint D at the cross head 11 and a joint E on the short link 8 side, and the 1st link 12a and the 2nd link 12b are connected to each other by a joint F. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005178350(A) 申请公布日期 2005.07.07
申请号 JP20040124156 申请日期 2004.04.20
申请人 LG CABLE LTD 发明人 PARK WON KI
分类号 B29C45/66;(IPC1-7):B29C45/66 主分类号 B29C45/66
代理机构 代理人
主权项
地址