| 发明名称 |
Controls of ambient environment during wafer drying using proximity head |
| 摘要 |
A method for processing a substrate is provided which includes generating a fluid meniscus to process the substrate and applying the fluid meniscus to a surface of the substrate. The method further includes reducing evaporation of fluids from a surface in the substrate processing environment.
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| 申请公布号 |
US2005145267(A1) |
申请公布日期 |
2005.07.07 |
| 申请号 |
US20040817398 |
申请日期 |
2004.04.01 |
| 申请人 |
LAM RESEARCH CORP. |
发明人 |
KOROLIK MIKHAIL;DE LARIOS JOHN M.;RAVKIN MIKE |
| 分类号 |
H01L21/304;B08B3/04;H01L21/00;(IPC1-7):B08B3/00 |
主分类号 |
H01L21/304 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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