| 发明名称 |
DICING/DIE BONDING FILM AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
A dicing/die bonding sheet is made by joining a base film (1) and a silicone based adhesive agent layer (3) through the medium of an undercoat layer (2). This all-in-one dicing/die bonding sheet exhibits superior long-term storage stability and prevents chip delamination during dicing. |
| 申请公布号 |
WO2005062374(A1) |
申请公布日期 |
2005.07.07 |
| 申请号 |
WO2004JP18531 |
申请日期 |
2004.12.07 |
| 申请人 |
DOW CORNING TORAY SILICONE CO., LTD.;SUTOH, MANABU;USHIO, YOSHITO |
发明人 |
SUTOH, MANABU;USHIO, YOSHITO |
| 分类号 |
C09J7/02;C09D5/00;C09D201/00;C09J183/04;H01L21/00;H01L21/301;H01L21/58;H01L21/68 |
主分类号 |
C09J7/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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