| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that the transmission characteristic is deteriorated to a large extent because of reflection when an RF signal is transmitted. SOLUTION: In the mounting structure of a semiconductor device, a semiconductor element 6 for transmitting and receiving the electrical signal of 40 to 80 GHz is accommodated, a semiconductor device 11 including an input/output pad 3a connected to the semiconductor element 6 at the lower surface is mounted on an external electric circuit board 12, and the input/output pad 3a is connected to a circuit conductor 13 of the external electric circuit board 12 via a solder bump 14. The distance between the lower surface of the semiconductor device 11 and the upper surface of the external electric circuit board 12 is set to 0.1 to 0.5 mm, and a gap between the semiconductor device 11 and external electric circuit board 12 is filled with a resin filling material 15. COPYRIGHT: (C)2005,JPO&NCIPI |
