发明名称 |
Method of transporting semiconductor device and method of manufacturing semiconductor device |
摘要 |
To prevent semiconductor chips from adhering to the trays during transport, a method is employed which transports semiconductor chips in the following state. When trays provided with a plurality of accommodating portions having a recessed cross section for accommodating semiconductor chips on a main surface thereof are stacked in a plurality of stages, the semiconductor chips are accommodated in spaces defined by the accommodating portions formed over the main surface of the lower-stage tray and corresponding accommodating portions formed over the back surface of the upper-stage tray. Here, on bottom surfaces of the accommodating portions formed over the back surface of the upper-stage tray, isolated projections having a height which prevents the projections from coming into contact with the semiconductor chips are arranged in a scattered manner. In this way, it is possible to prevent the semiconductor chips from adhering to the back surface of the upper-stage tray.
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申请公布号 |
US2005147488(A1) |
申请公布日期 |
2005.07.07 |
申请号 |
US20040007185 |
申请日期 |
2004.12.09 |
申请人 |
MATSUBARA YOSHIHISA;SUZUKI HIROMICHI;KITAMURA WAHEI;AKIYAMA KOSHO;KATO SEIJI |
发明人 |
MATSUBARA YOSHIHISA;SUZUKI HIROMICHI;KITAMURA WAHEI;AKIYAMA KOSHO;KATO SEIJI |
分类号 |
B65D21/02;B65D85/86;H01L21/673;H01L21/68;(IPC1-7):G06F19/00;B66C17/08;H01L23/48;H01L29/40 |
主分类号 |
B65D21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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