Minimizing whisker growth in tin electrodeposits

摘要

The present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are essentially free of compressive stress or are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth. The deposits preferably exhibit no compressive stress or exhibit a tensile stress. Also, the most preferred crystal orientation is one that is the same as that of the underlying metal. The deposit preferably contains at least 95% tin and optionally at least one alloying element of silver, bismuth, copper or zinc in an amount of 5% or less.