Disclosed are a multi-die processor apparatus and system. Processor logic to execute one or more instructions is allocated among two or more face-to-faces stacked dice. The processor includes a conductive interface between the stacked dice to facilitate die-to-die communication.
申请公布号
WO2005062190(A1)
申请公布日期
2005.07.07
申请号
WO2004US39236
申请日期
2004.11.24
申请人
INTEL CORPORATION;BLACK, BRYAN;SAMRA, NICHOLAS;WEBB, M., CLAIR