UBM FOR REALIZING MICRO SOLDER/BALL AND FLIP CHIP/ PACKAGE METHOD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a UBM (Under BUMP Metal) for realizing a micro solder/ball configured from a relief pattern structure and a flip chip/package method using the same.

SOLUTION: The flip chip/package comprises: a first substrate which is formed on a first electrode terminal and one area in the upper area of the first electrode terminal and provided with a first UBM (Under Bump Metal) electrically connected to the first electrode terminal; and a second substrate on which the flip chip/package is formed on a second electrode terminal corresponding to the first electrode terminal and one area in the upper area of the second electrode terminal and provided with a second UBM electrically connected to the second electrode terminal, when flip chip/bonding is performed on the first and second substrates; and further a concavity in at least one area adjacent to the area where the first UBM is formed so as to allow the first substrate to partially receive the solder/ball connecting the first and second UBM's.

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