| 摘要 |
PROBLEM TO BE SOLVED: To solve problems that, when many sorts of products are processed by using the same semiconductor manufacturing apparatus, the stack amounts of products generated due to differences in the film thickness or etching quantity of formed films are different in each sort, and thereby even when process characteristics are changed due to reactive products stuck to the inside of a reaction room, the changes can not be checked before an inspection in a succeeding process, and a loss to be generated up to the inspection may be fairly large. SOLUTION: The plasma processor is constituted so that the opening of a pressure controlling valve 5 for controlling pressure to a required level in process processing and bias voltage generated when high frequency power is impressed are always monitored by a facility monitoring system, whether either one of data or both the data are deviated from previously set values or not is compared, the contents of facility maintenance are judged, and a maintenance instruction is transmitted to the external. COPYRIGHT: (C)2005,JPO&NCIPI
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