| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding method by which quality can be improved and a bonding duct can be shortened, and to provide a semiconductor manufacturing device. SOLUTION: The thickness of a semiconductor chip 1 is measured and measurement data are stored. The pickup level of an absorption maintenance means 2A before it is made to abut on one surface in the thickness direction of the semiconductor chip 1 is set based on measurement data. COPYRIGHT: (C)2005,JPO&NCIPI
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