发明名称 Thermoplastic polyamide moulding compositions
摘要 The present invention relates to thermoplastic polyamide moulding compositions which contain at least one copolyamide with at least 20% by weight polyamide 12 components and at least one aprotic compound selected from the group of N-alkylated, cyclic carboxylic acid amides with 5 to 7 ring elements and/or of urea derivatives, the alkyl rests of which are linear at the nitrogen or which form a linking of the two N-atoms, and a process for production of the moulding compositions. The thermoplastic polyamide moulding compositions are distinguished by the fact that no solid deposits are formed during thermoplastic conversion.
申请公布号 US2005148729(A1) 申请公布日期 2005.07.07
申请号 US20040026243 申请日期 2004.12.29
申请人 SCHMID EDUARD;REXIN ORNULF 发明人 SCHMID EDUARD;REXIN ORNULF
分类号 C08K5/17;C08K5/21;C08K5/3412;C08L77/00;C08L77/02;C08L77/06;(IPC1-7):C08L51/00 主分类号 C08K5/17
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