An illumination assembly includes a substrate having an electrically insulative layer on a first side of the substrate and an electrically conductive layer on a second side of the substrate. A plurality of LED dies is disposed on the substrate. Each LED die is disposed in a via extending through the electrically insulative layer on the first side of the substrate to the electrically conductive layer on the second side of the substrate. Each LED die is operatively connected through the via to the electrically conductive layer.
申请公布号
WO2005062382(A2)
申请公布日期
2005.07.07
申请号
WO2004US37522
申请日期
2004.11.09
申请人
3M INNOVATIVE PROPERTIES COMPANY
发明人
SCHULTZ, JOHN C.,;LARSON, DONALD K.,;MILLER, MICHAEL N.,