method for flatting of semiconductor device,申请号KR20000064890-传众专利搜索

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发明名称	method for flatting of semiconductor device
摘要
申请公布号	KR100499556(B1)	申请公布日期	2005.07.07
申请号	KR20000064890	申请日期	2000.11.02
申请人		发明人
分类号	H01L21/3105;(IPC1-7):H01L21/310	主分类号	H01L21/3105
代理机构		代理人
主权项
地址

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